Adapting electroforming techniques for the manufacture of architectural building elements

ABSTRACT

A method of manufacturing an architectural building element, including providing a mold or master having a surface that is conductive. The mold or master is suspended in an electrolyte solution. Electro-deposition of a material disposed in the electrolyte solution upon the mold or master is performed using electrical current. The mold or master is removed from the electrolyte solution upon electro-deposition of a predetermined thickness of a coating of the material on the mold or master. The coating is then divorced from the mold or master to form an architectural building element.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 61/845,435, filed on Jul. 12, 2013. The entire disclosure of the above application is incorporated herein by reference.

FIELD

The present disclosure relates to the manufacture of architectural building elements and, more particularly, relates to adapting electroforming techniques for the manufacture of architectural building elements.

BACKGROUND AND SUMMARY

This section provides background information related to the present disclosure which is not necessarily prior art. This section also provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

Known techniques in the manufacture of metal stock materials used in the construction of static structures (i.e., buildings) are formed using common metalworking techniques on sheet or plate metal to create structural and ornamental elements. These techniques require large preliminary investment and infrastructure which ultimately leads to the production of standardized mass produced elements to compensate for early costs.

In contrast, electroforming requires minimal up front investment and can be adapted for mass customization. Additionally, electroforming can achieve formal variations impossible in standard metal forming techniques (undercutting, complex molds, embedded substrates, and refined detailing). The application of electroforming to the production of architectural elements will provide more accessible and variable architectural ornaments and detailing.

While conventional electroforming often relies on expensive resin molds and enduring masters, the present teachings deploy low cost replication techniques, using disposable molds, and embedded masters, which can be used in exterior architectural paneling, interior architectural paneling, structure architectural elements (i.e. gussets, load bearing members, and the like), lighting fixtures, furnishings, and other ornaments.

The present teachings explore hybrid ways of making/reviving

Nineteenth Century metal electroforming techniques and adjusting them to contemporary design and fabrication methods. In re-imagining electroforming as an intrepid, present-day process that moves beyond the simple replication of metallic objects on a master form, the strategy tests novel aesthetic, material and economic possibilities in service of mass customization. Using expendable and embedded substrates in addition to master molds, the prototypes generate distinct metallurgical ornament and articulated skins. More importantly, perhaps, the process also conceives of a new mode of small scale fabrication—one that is adaptive, nomadic and generative.

Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

FIG. 1 is a plan view of a plurality of exemplary architectural building elements having a tessellated construction being made in accordance with the principles of the present teachings;

FIG. 2 is a plan view of a series of tessellated designs according to the principles of the present teachings;

FIG. 3 is a perspective view of a mold or master formed according to the principles of the present teachings;

FIG. 4 is a perspective view of a set of three tessellated members being prepared prior to electroforming;

FIGS. 5A-5D is a series of views illustrating the vacuum forming technique of applying a disposable vacuum-formed styrene sheet to the tessellated master;

FIG. 6 illustrates the addition of components to the electrolyte solution;

FIG. 7 illustrates the disposable vacuum-formed styrene sheet, shaped according to the tessellated member, being deposited into the electrolyte solution;

FIG. 8 is a schematic perspective view illustrating a mobile construction lab for producing the tessellated building element of the present teachings;

FIG. 9 is a photograph illustrating a surface finish attainable by the present teachings;

FIG. 10 illustrates a top and bottom view of the electroformed architectural building element after being divorced from the mold or master, prior to trimming; and

FIG. 11 illustrates the disposable vacuum-formed styrene sheet, the untrimmed electroformed architectural building element after being divorced from the mold or master, and the final trimmed tessellated electroformed architectural building element according to the principles of the present teachings.

Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference to the accompanying drawings.

Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being “on,” “engaged to,” “connected to,” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as “inner,” “outer,” “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Technique

Electroforming is a deceptively simple process, produced through the deployment of a series of variable and contingent components: matrix material, chemical bath, and substrate. Conventionally, the practice begins with a mold, or master, whose surface is made conducting with a thin coat of graphite powder or paint. A wire is attached to the conducting surface and the mold is suspended in an electrolyte solution as illustrated in FIG. 7.

Electro-deposition of the material—typically alloy foil, silver, nickel, or copper—is activated using electrical currents. When the mold is coated to the desired thickness, the object is removed from the bath and divorced, partially or totally, from the original mold as illustrated in FIGS. 10 and 11. Any final trimming can be complete following divorcing.

The outward straightforwardness of the process disguises the extraordinary range of effects that can be achieved through the adjustment of the matrix mix, plating bath composition, and conditions of the depositor. All of these factors contribute to the production of components that cannot be realized via sheet metal fabrication techniques. When correctly calibrated, the operation economically allows for unmatched dimensional accuracy, thin material sections, complex curvatures, and refined detailing with no limit to the size of the object that can be electroformed. And most exciting, the process can be adapted to contemporary logics of mass customization by reconceiving the master as a disposable, imbedded or inexpensive artifact. The resultant operations enable the fabrication of economical variation.

Ornamental Skin

In developing our series of prototypical articulated modules, we were interested in maximizing variation while relying on a single interlocking unit. Each simple component is identical in plan as illustrated in FIGS. 1 and 2.

The units are designed in clusters of three discrete topographies, as seen in FIG. 2, in order to suggest the possibility of a tessellated heterogeneous field. We developed a catalogue of 90 plus adaptations—each concerned with the production and perception of heightened discrepancy, but bound by the logics of economic plausibility and frugality.

While conventional electroforming often relies on expensive resin molds and enduring masters, the present teachings deploys low cost replication techniques, using vacuformed styrene plates produced from CNC milled medium density fiber board. Diffusing the cost of the original mill-work over the span of the production run ensures that the cost of the replicated master remains low.

Disposable Masters/Tessellated Fields

Electroforming is a plating process where a conducting mandrel, or mold, attached to a wire is immersed in an electrolyte bath with a reducing agent. The metal dissolves into ions that progressively deposit themselves around the mandrel until they reach a desired thickness. While the chemical plating procedure was invented in the 19th Century, the mold material has remained unchanged, and is typically produced using expensive silicone mold techniques to ensure reusability.

In the present method, the traditional mold has been substituted with an inexpensive, easy to reproduce, disposable vacuum-formed styrene sheet. This critical adaptation allows for the multiplication of identical masters and, consequently, the economical mass customization of ornamental modules.

The process can begin by using a CNC machine or other suitable device to construct a blank or other member having a solid construction (see FIGS. 3 and 4). This can be done using any material that is easily formable, such as fiber board. Ideally, the CNC blank will define a tessellated shape. That is, a tessellate shape being a shape having a repeating pattern as seen in FIGS. 1 and 2. In some embodiments, the tessellate shape is regular, repeating polygonal members. In some embodiments, these members can include a set of three members, each having a different shape from the other, but each being interlocking with one another to form a structure that is void of holes or gaps between adjacent members. Moreover, the set of three members according to the principles of the present teachings are interlocking with adjacent sets of three such that the entire field of tessellated members of the present teachings can be joined as to be void of holes or gaps between adjacent members and/or sets. In some embodiments, the shape of each member of each set is irregular, thereby not defining a regular geometric shape.

After construction of the CNC blank—that is, members having a generally solid construction in the shape of the desired tessellated shape—the blank can be placed in a vacuum-forming device as illustrated in FIGS. 5A-5D. A styrene sheet can be placed over the blank to vacuum formed to produce a mold or master being made of the styrene material, or other plastic, synthetic, or suitable material, as illustrated in FIG. 5D.

The Process

Electroforming starts with a bar of metal, an electrolyte solution, a synthetic master and current as illustrated in FIGS. 6 and 7. We chose to work with copper because it requires the least toxic solution. Alternate metal deposits could be produced in a similar manner.

The metal can then be deposited on virtually any solid, synthetic material (e.g. the styrene mold or master), and the process can be deployed progressively, building up fine layers of multiple metal matrices in order to achieve a desired finish, tensile strength and complex form.

Electroforming differs greatly from metalworking techniques such as punching and milling in that it produces virtually no waste other than the substrate material which, if strategically applied can remain at the core of the finished product, enhancing the structural performance of the composite.

Engaging contemporary digital design and fabrication techniques, our research tested a wide variety of materials and aggregate modeling techniques.

Color

Further variation in the tile color palette is achieved by allowing copper to tarnish and discolor naturally, as illustrated in FIG. 9. Once a desired patina is achieved, the oxidization process is arrested with a polyurethane veneer. Distinction in the aggregate field is thus a natural form of decomposition, curated for effect. Additional color variation can be achieved using subsequent metal deposition, including, but not limited to silver, gold, nickel, tin, and chrome.

The Lab

Electroforming facilities can be compact and mobile, as small and itinerant as the sum of their component parts, as seen in FIG. 8. Depending on the desired output, the facility can be transported with relative ease. All that is required is a source of current, a rectifier, and a plastic receptacle. The process also allows for the utilization and adaptation of existing electroplating infrastructure from alternate industries including but not limited to jewelry and automotive manufacturing.

We built an adjustable lab—a mobile copper plating unit that can be broken down into an 8′×8′ base module, with 4′×8′ additional expansion modules.

The lab allowed us to test a tremendous matrix of possible substrates in order to explore new material and fabrication possibilities.

The Appeal

There are four critical reasons that we find electroplating so appealing as a mode of contemporary architectural production.

(1) Size does not matter. The process can be adapted to a variety of scales—from cufflink to submarine. Here scale is simply the consequence of a tank's capacity to hold solution.

(2) It is molecular. The process means imbeds the possibility of reuse into production. Failed designs just go back into the tank as source material for further fabrication.

(3) It favors short run production. Neither precious like the artisan, nor imitable through large scale production, electroplating firmly sides with the logics of small batch making intrinsic to customization.

(4) Nomadic fabrication is here. Electroplating facilities can be compact and mobile, as small and itinerant as the sum of their component parts.

Depending on the desired output, the facility can be transported with relative ease. All that is required is a source of current, a rectifier, and a plastic receptacle. The process also allows for the reuse of existent manufacturing infrastructure from fields outside of architectural element production, including but not limited to jewelry and automotive manufacturing.

The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure. 

What is claimed is:
 1. A method of manufacturing an architectural building element, the method comprising: providing a mold or master having a surface, the surface being conductive, the mold or master having a tessellated shape; suspending the mold or master in an electrolyte solution; electro-depositing a material disposed in the electrolyte solution upon the mold or master using electrical current; removing the mold or master from the electrolyte solution upon electro-deposition of a predetermined thickness of a coating of the material on the mold or master; and divorcing the coating from the mold or master to form a tessellated architectural building element.
 2. The method according to claim 1 wherein the providing a mold or master comprises: forming a tessellated shaped blank from fiber board; vacuum forming a synthetic around at least a portion of the blank; separating the synthetic from the blank after the vacuum forming to form the mold or master; and applying conductive material to the surface of the mold or master.
 3. The method according to claim 1, further comprising: electro-depositing a second material disposed in the electrolyte solution upon the mold or master using electrical current to achieve a varying material blend.
 4. The method according to claim 1 wherein the providing a mold or master having a surface, the surface being conductive, comprises providing a mold or master having a conductive graphite surface.
 5. A method of manufacturing architectural building elements, the method comprising: providing a plurality of molds or masters each having a surface, the surface being conductive, each of the plurality of molds or masters having a tessellated shape that is complementary to the other of the plurality of molds or masters to be devoid of gaps therebetween when joined together; suspending the plurality of molds or masters mold or master in an electrolyte solution; electro-depositing a material disposed in the electrolyte solution upon the plurality of molds or masters using electrical current; removing the plurality of molds or masters from the electrolyte solution upon electro-deposition of a predetermined thickness of a coating of the material on the plurality of molds or masters; and divorcing the coating from the plurality of molds or masters to form a plurality of tessellated architectural building elements each being joinable with the others of the plurality of tessellated architectural building elements to be devoid of gaps therebetween.
 6. The method according to claim 5 wherein the plurality of molds or masters comprises at least three molds or masters, each of the at least three molds or masters having a different tessellated shape that is complementary to the other of the at least three molds or masters to be devoid of gaps therebetween when joined together.
 7. The method according to claim 5 wherein the plurality of molds or masters comprises at least six molds or masters, a first three of the at least six molds or masters forming a first set and a second three of the at least six mold or masters forming a second set, each of the first set having a different tessellated shape that is complementary to the others of the first set to be devoid of gaps therebetween when joined together, the first set collectively further defining a tessellated shape that is complementary to the second set collective to be devoid of gaps therebetween when joined.
 8. The method according to claim 5 wherein the providing a plurality of molds or masters comprises: forming a plurality of tessellated shaped blanks from fiber board; vacuum forming a synthetic around at least a portion of the blanks; separating the synthetic from the blanks after the vacuum forming to form the plurality of molds or masters; and applying conductive material to the surface of the plurality of molds or masters.
 9. The method according to claim 5, further comprising: electro-depositing a second material disposed in the electrolyte solution upon the plurality of molds or masters using electrical current to achieve a varying material blend.
 10. The method according to claim 5 wherein the providing a plurality of molds or masters each having a surface, the surface being conductive, comprises providing a plurality of molds or masters each having a conductive graphite surface. 